Semicnductor Multi-channel Chiller

FLTZ 30℃~100℃

Chiller high precision hot and cold circulator

Temperture accuracy±0.1℃
RefrigentR404A
Flow control25~75/min 6bar max
Power range380V 3kW~17kW

INQUIRY

Product details parameters

FLTZ -10℃~90℃ Dual Channel

Model	FLT-215W/ETCU-015W/ETCU-008W
Pipeline	Channel 1	Channel 2	Channel 3
Temperature range	-20℃～+50℃	+30℃～+100℃	+30℃～+40℃
Temperature control accuracy	±0.1℃	±0.1℃	±0.1℃
Cooling capacity	15kW@-10℃	13kW@PCW+15℃	8kW@PCW+10℃
Heating capacity	2kW	6kW	Pump Heat Loss
Heat transfer medium flow	30L/min@0.85MPa	30L/min@0.85MPa	20L/min@0.8MPa
Heat transfer medium interface	ZG3/4	ZG3/4	ZG3/4
Ambient temperature	10～35 ℃	10～35 ℃	10～35 ℃
Ambient humidity	30～70%	30～70%	30～70%
Cooling water temperature	15～20℃	15～20℃	15～20℃
Cooling water flow	30L/min@15~20℃	15L/min@15~20℃	15L/min@15~20℃
Circuit breaker	75A
Process temperature control	Control remote target temperature based on self-created model-free self-building tree algorithm and cascade algorithm
Weight	600kg
Dimensions	60010001700

Model	FLTZ-203W/2T Dual system		FLTZ-305W/2T Dual system		FLTZ-406W/2T Dual system
Temperature range	-20℃~90℃		-30℃~90℃		-45℃~90℃
Temperature control accuracy	±0.1℃
Flow control and pressure	15~45l/min 6bar max
Heating	2.5kw	2.5kw	2.5kw	2.5kw	3.5kw	3.5kw
Cooling capacity	3KW at-15℃	3KW at-15℃	5KW at-15℃	5KW at-15℃	2.5KW at -35℃	2.5KW at -35℃
Internal circulation liquid volume	5L	5L	8L	8L	8L	8L
Expansion tank volume	15L		25L		25L
Heat transfer medium	Fluorination, antifreeze, thermal silicone oil, etc.
Refrigerant	R404A/ R448
Heat transfer medium interface	ZG3/4
Cooling water interface	ZG3/4
Cooling water	50L/min at20℃		600L/min at20℃		50L/min at20℃
Power supply	Three-phase220V / Three-phase 400V /Three-phase 460V
Process temperature control	Control remote target temperature based on self-created model-free self-building tree algorithm and cascade algorithm

FLTZ -45℃~90℃ Dual Channel

Model	FLTZ-203W/2T dual system		FLTZ-305W/2T dual system		FLTZ-406W/2T dual system
Temperature range	-20℃~90℃		-30℃~90℃		-45℃~90℃
Temperature control accuracy	±0.1℃
Heat conducting medium flow rate	15~45l/min 6bar max
Heating capacity	2.5kW	2.5kW	2.5kW	2.5kW	3.5kW	3.5kW
Cooling capacity	3kW at-15℃	3kW at-15℃	5kW at-15℃	5kW at-15℃	2.5kW at -35℃	2.5kW at -35℃
Internal circulation fluid volume	5L	5L	8L	8L	8L	8L
Expansion tank volume	15L		25L		25L
Heat-conducting medium	Fluorinated liquid, antifreeze, thermal conductive silicone oil, etc
Refrigerant	R404A/ R448
Heat-conducting medium interface	ZG3/4
Cooling water interface	ZG3/4
Cooling water interface	50L/min at20℃		600L/min at20℃		50L/min at20℃
Power	Three phase 220V/Three phase 400V/Three phase 460V
Process temperature control	The remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm

FLTZ -20℃~90℃ Dual Channel

Model	FLTZ-203W-2T
Pipeline	Channel 1	Channel 2
Temperature range	-20℃～+90℃	-20℃~～90℃
Temperature control accuracy	±0.1℃	±0.1℃
Cooling capacity	4kW@-10℃	4kW@-10℃
Heating capacity	2kW	2kW
Heat transfer medium flow	20L/min@0.5MPa	20L/min@0.5MPa
Heat transfer medium interface	ZG3/4	ZG3/4
Ambient temperature	10～35℃	10～35℃
Ambient humidity	30～70%	30～70%
Cooling water temperature	15～20℃	15～20℃
Cooling water flow	20L/min	20L/min
Circuit breaker	30A
Process temperature control	Control remote target temperature based on self-created model-free self-building tree algorithm and cascade algorithm
Weight	400kg
Dimensions	5009001600

Temperature control in semiconductor production testing processes

Heating method within 40 ℃ adopts a compressor hot gas heating fully enclosed design, and the machine operates continuously for 24 hours

Ensure stable and reliable overall semiconductor process flow from front-end to back-end

Mainly used for precise temperature control in semiconductor production and testing processes, heating within 40 ° C using a compressor hot gas heating method

Product Descriptions

1. Independent Temperature Ranges: Supports multiple channels with separate temperature control ranges to meet diverse operational needs.
2. Cooling and Heating Capabilities: Enables both cooling and heating functions for enhanced flexibility in temperature management.
3. Flexible System Options: Offers two system configurations—steam compression refrigeration or ETCU compressor-free heat exchange systems—tailored to the required temperature range.
4. Integrated Design: Incorporates components like expansion tanks, condensers, and cooling water systems to optimize performance and efficiency.
5. Compact and User-Friendly: Designed to reduce equipment size and simplify operational steps, improving overall usability and convenience.

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