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Precision temperature control is crucial in semiconductor manufacturing, where advancements in wafer technology demand ever-greater accuracy. From material removal and deposition to growth and testing, maintaining precise temperature is essential to ensure optimal process performance and reliable outcomes.
Semiconductor manufacturing is a process with extremely high environmental requirements, and many process steps are very sensitive to temperature. For example, in the photolithography process, the optical system of the photolithography machine needs to work in a stable temperature environment, because a slight change in temperature may cause deviations in the optical path, which in turn affects the accuracy of the photolithography. In processes such as chemical vapor deposition (CVD) and physical vapor deposition (PVD), the reaction temperature directly affects the quality and performance of the film. Accurate temperature control can ensure that the deposited film has uniform thickness and accurate composition, thereby improving the performance and yield of the chip.
The semiconductor FAB (Fabrication) process is a series of complex processes that process semiconductor materials (such as silicon) into integrated circuit (IC) chips, and is the cornerstone of the modern electronics industry. In this highly precise manufacturing process, temperature control plays a vital role. Slight temperature fluctuations may directly affect the performance of semiconductor materials and the reliability of equipment. Therefore, temperature control technology is particularly important in the FAB process.
The system offers multi-channel independent temperature control, allowing each channel to have its own temperature range, cooling and heating capacity, and heat transfer medium flow. It features two separate systems for enhanced reliability. Depending on the required temperature range, users can choose between steam compression refrigeration or the ETCU compressor-free heat exchange system. The design incorporates an expansion water tank, condenser, and cooling water system, optimizing space efficiency and simplifying operation steps.
lowest
Highest
Temperature control accuracy
Fast and precise temperature control for complex processes. Lneya temperature control systems provide repeatable temperature control for plasma etching applications.
The output pressure and flow rate of the circulating liquid can be set on the operation panel. Even under various customer piping conditions, without bypass piping adjustment, it can be automatically controlled at the set output pressure through a variable frequency pump. As a result, the power consumption of the pump can be reduced.
Depending on the flow rate, bypass piping may be required
Due to the use of heat generated during heating, circulating heating can be achieved without the need for a heater
Standard serial communication (RS232C,RS485) and contact input/output (3 points output, 2 points input). Depending on the purpose, you can communicate with customer devices or build systems. In addition, there is also a DC24V output, which can be used when setting the flow switch, etc.
The control interface of the refrigeration and heating temperature control system, multi-function image shows a variety of related information
Display: real-time temperature of each temperature control point, exhaust suction temperature (pressure), condensation temperature, cooling water temperature (pressure), inlet and outlet liquid (gas) temperature (pressure), electric power, current of each component, voltage, water tank liquid level, etc
Thermal testing verifies the stability of chip functions and the reliability of parameters by simulating multiple temperature scenarios (such as low temperature, high temperature and normal temperature). At the same time, it can also effectively evaluate the heat dissipation performance of the chip and the rationality of the thermal design, and troubleshoot potential failure risks, such as mechanical stress caused by thermal expansion or material degradation caused by overheating. The optimization of this link can not only improve the applicability of the chip, but also provide a guarantee for the high quality and high reliability of the product.
In the semiconductor packaging and testing process, thermal testing is a crucial link, which is used to evaluate the performance and reliability of chips under different temperature conditions. With the rapid development of chip technology, the importance of thermal testing has become increasingly prominent, especially in application fields such as high-performance computing, automotive electronics and industrial control that require strict environmental adaptability.
The output airflow hood of the test machine encloses the test product to create a relatively sealed test environment. By directing high or low-temperature airflow onto the test product, it induces rapid surface temperature changes, enabling precise high and low-temperature shock testing.
This approach allows targeted testing of individual ICs or specific components without affecting surrounding parts. Compared to traditional thermal shock chambers, it offers significantly faster temperature shock rates, enhancing efficiency and precision in testing.
-120 °C ~ +300 °C
Temperature range:
-55 °C ~ 150 °C < 10 seconds
The temperature rise and fall is very fast
±0.1 °C
Temperature control accuracy
25m3/h
Maximum air flow
• Designed for cooling non-corrosive gases such as compressed air, nitrogen, and argon.
• Room-temperature gases are introduced into the LQ series equipment.
• Output gases are cooled to the desired low-temperature levels.
• Cooled gases can then be supplied to components or heat exchangers for testing purposes.
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