Semicnductor Multi-channel Chiller
FLTZ 30℃~100℃- Temperture accuracy±0.1℃
- RefrigentR404A
- Flow control25~75/min 6bar max
- Power range380V 3kW~17kW
Product details parameters
| Model | FLT-215W/ETCU-015W/ETCU-008W | ||
| Pipeline | Channel 1 | Channel 2 | Channel 3 |
| Temperature range | -20℃~+50℃ | +30℃~+100℃ | +30℃~+40℃ |
| Temperature control accuracy | ±0.1℃ | ±0.1℃ | ±0.1℃ |
| Cooling capacity | 15kW@-10℃ | 13kW@PCW+15℃ | 8kW@PCW+10℃ |
| Heating capacity | 2kW | 6kW | Pump Heat Loss |
| Heat transfer medium flow | 30L/min@0.85MPa | 30L/min@0.85MPa | 20L/min@0.8MPa |
| Heat transfer medium interface | ZG3/4 | ZG3/4 | ZG3/4 |
| Ambient temperature | 10~35 ℃ | 10~35 ℃ | 10~35 ℃ |
| Ambient humidity | 30~70% | 30~70% | 30~70% |
| Cooling water temperature | 15~20℃ | 15~20℃ | 15~20℃ |
| Cooling water flow | 30L/min@15~20℃ | 15L/min@15~20℃ | 15L/min@15~20℃ |
| Circuit breaker | 75A | ||
| Process temperature control | Control remote target temperature based on self-created model-free self-building tree algorithm and cascade algorithm | ||
| Weight | 600kg | ||
| Dimensions | 600*1000*1700 | ||
| Model | FLTZ-203W/2T Dual system | FLTZ-305W/2T Dual system | FLTZ-406W/2T Dual system | |||
| Temperature range | -20℃~90℃ | -30℃~90℃ | -45℃~90℃ | |||
| Temperature control accuracy | ±0.1℃ | |||||
| Flow control and pressure | 15~45l/min 6bar max | |||||
| Heating | 2.5kw | 2.5kw | 2.5kw | 2.5kw | 3.5kw | 3.5kw |
| Cooling capacity | 3KW at-15℃ | 3KW at-15℃ | 5KW at-15℃ | 5KW at-15℃ | 2.5KW at -35℃ | 2.5KW at -35℃ |
| Internal circulation liquid volume | 5L | 5L | 8L | 8L | 8L | 8L |
| Expansion tank volume | 15L | 25L | 25L | |||
| Heat transfer medium | Fluorination, antifreeze, thermal silicone oil, etc. | |||||
| Refrigerant | R404A/ R448 | |||||
| Heat transfer medium interface | ZG3/4 | |||||
| Cooling water interface | ZG3/4 | |||||
| Cooling water | 50L/min at20℃ | 600L/min at20℃ | 50L/min at20℃ | |||
| Power supply | Three-phase220V / Three-phase 400V /Three-phase 460V | |||||
| Process temperature control | Control remote target temperature based on self-created model-free self-building tree algorithm and cascade algorithm | |||||
| Model | FLTZ-203W/2T dual system | FLTZ-305W/2T dual system | FLTZ-406W/2T dual system | |||
| Temperature range | -20℃~90℃ | -30℃~90℃ | -45℃~90℃ | |||
| Temperature control accuracy | ±0.1℃ | |||||
| Heat conducting medium flow rate | 15~45l/min 6bar max | |||||
| Heating capacity | 2.5kW | 2.5kW | 2.5kW | 2.5kW | 3.5kW | 3.5kW |
| Cooling capacity | 3kW at-15℃ | 3kW at-15℃ | 5kW at-15℃ | 5kW at-15℃ | 2.5kW at -35℃ | 2.5kW at -35℃ |
| Internal circulation fluid volume | 5L | 5L | 8L | 8L | 8L | 8L |
| Expansion tank volume | 15L | 25L | 25L | |||
| Heat-conducting medium | Fluorinated liquid, antifreeze, thermal conductive silicone oil, etc | |||||
| Refrigerant | R404A/ R448 | |||||
| Heat-conducting medium interface | ZG3/4 | |||||
| Cooling water interface | ZG3/4 | |||||
| Cooling water interface | 50L/min at20℃ | 600L/min at20℃ | 50L/min at20℃ | |||
| Power | Three phase 220V/Three phase 400V/Three phase 460V | |||||
| Process temperature control | The remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm |
|||||
| Model | FLTZ-203W-2T | |
| Pipeline | Channel 1 | Channel 2 |
| Temperature range | -20℃~+90℃ | -20℃~~90℃ |
| Temperature control accuracy | ±0.1℃ | ±0.1℃ |
| Cooling capacity | 4kW@-10℃ | 4kW@-10℃ |
| Heating capacity | 2kW | 2kW |
| Heat transfer medium flow | 20L/min@0.5MPa | 20L/min@0.5MPa |
| Heat transfer medium interface | ZG3/4 | ZG3/4 |
| Ambient temperature | 10~35℃ | 10~35℃ |
| Ambient humidity | 30~70% | 30~70% |
| Cooling water temperature | 15~20℃ | 15~20℃ |
| Cooling water flow | 20L/min | 20L/min |
| Circuit breaker | 30A | |
| Process temperature control | Control remote target temperature based on self-created model-free self-building tree algorithm and cascade algorithm | |
| Weight | 400kg | |
| Dimensions | 500*900*1600 | |
Temperature control in semiconductor production testing processes
Heating method within 40 ℃ adopts a compressor hot gas heating fully enclosed design, and the machine operates continuously for 24 hours
Ensure stable and reliable overall semiconductor process flow from front-end to back-end
Mainly used for precise temperature control in semiconductor production and testing processes, heating within 40 ° C using a compressor hot gas heating method
Product Descriptions
1. Independent Temperature Ranges: Supports multiple channels with separate temperature control ranges to meet diverse operational needs.
2. Cooling and Heating Capabilities: Enables both cooling and heating functions for enhanced flexibility in temperature management.
3. Flexible System Options: Offers two system configurations—steam compression refrigeration or ETCU compressor-free heat exchange systems—tailored to the required temperature range.
4. Integrated Design: Incorporates components like expansion tanks, condensers, and cooling water systems to optimize performance and efficiency.
5. Compact and User-Friendly: Designed to reduce equipment size and simplify operational steps, improving overall usability and convenience.
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